Device Technologies, Inc. - Shield-Fast™ SMT and DMT Series Metal Foil Adhesive Tapes

Unit of Measure

Items	SMTAL007 0.0028 Inch (in) Thickness Shield-Fast™ SMT Series Metal Foil Single Sided Adhesive Tape	SMTAL005 0.0022 Inch (in) Thickness Shield-Fast™ SMT Series Metal Foil Single Sided Adhesive Tape	SMTAL010N 0.0039 Inch (in) Thickness Shield-Fast™ SMT Series Metal Foil Single Sided Adhesive Tape	SMTALP007N-PET 0.0028 Inch (in) Thickness Shield-Fast™ SMT Series Metal Foil Single Sided Adhesive Tape	SMTCU007 0.0028 Inch (in) Thickness Shield-Fast™ SMT Series Metal Foil Single Sided Adhesive Tape
Description	N/A DTi offers an extremely broad range of metal foil based conductive adhesive tapes. The SMT Series Metal Foil Tapes are produced using highly conductive adhesives laminated onto thin copper or aluminum sheets offering cost-effective, low-profile mechanical, electrical, and adhesive properties. These characteristics provide a thin, lightweight, and flexible shielding design. Available in roll, sheet or custom die-cut forms.
Thickness	N/A 0.0028 in0.070 mm	N/A 0.0022 in0.055 mm	N/A 0.0039 in0.100 mm	N/A 0.0028 in0.070 mm	N/A 0.0028 in0.070 mm
Width	N/A 39.37 in1000 mm	N/A 39.37 in1000 mm	N/A 19.69 in500 mm	N/A 39.37 in1000 mm	N/A 25.59 in650 mm
Length	N/A 164 ft50 m	N/A 164 ft50 m	N/A 164 ft50 m	N/A 164 ft50 m	N/A 82 ft25 m
Contact Resistivity	N/A ≤0.10 ohm/square	N/A ≤0.05 ohm/square	N/A	N/A	N/A ≤0.10 ohm/square
Adhesive Strength per 25 mm	N/A ≥800 gf	N/A ≥600 gf	N/A ≥1000 gf	N/A ≥1800 gf	N/A ≥900 gf
Service Temperature	N/A 60 to 100 ºF15 to 38 ºC
Material for First Class Protection	N/A Aluminum Copper
Properties	N/A Adhesive Cost-Effective Electrical Low-Profile Mechanical
Characteristics	N/A Flexible Shielding Design. Lightweight Thin
Industry Standards/Certifications	N/A AS9100 B NSAI Certified ISO 9001:2008 NSAI RoHS compliant
Features and Benefits	N/A Highly flexible High conductivity Excellent shielding effectiveness Copper or aluminum foils Corrosion resistant Single or double sided construction
Applications	N/A Wire harnesses Grounding Sealing seams
Application Techniques	N/A Bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning agent. Bond strength can be increased by applying ST Series PSA firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable. Adhesion strength increases with 24-hour cure cycle due to increased wetting by the tape. Enhanced electrical performance with ST Series PSA by lightly roughing the metal surface. ST Series PSA should be applied between 60 ºF - 100 ºF(15 ºC - 38 ºC). Tape application below 50 ºF (10 ºC) is not recommended. Warming the substrates to 100 ºF (38 ºC) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.
Note	N/A Custom layer configurations available. Contact Customer Service for information and free samples. Certified Vendor to Fortune 100 & 500 OEMs, JIT with MAJOR OEMs Worldwide, supported by International Distribution The information contained in this data sheet is based on our experience to date and is believed to be reliable. It is intended as a guide for use by persons having technical skill at their discretion and risk. We do not guarantee favorable results or assume any liability in connection with its use. Dimensions contained herein are for reference purposes only. For specific dimensional requirements, consult the factory. This publication is not to be taken as license to operate under, or a recommendation to infringe upon any existing patents. This supersedes and voids all previous literature, etc. Device Technologies, Inc. expressly disclaims any and all express or implied warranties concerning its products including without limitation, warranty of fitness for a particular purpose and warranty of merchantability.