COMPANY HEADER
Print Back
Conductive cushion gaskets offer an innovative approach to traditional shielding and grounding by providing X, Y and Z axis conductivity which enhances the shielding effectiveness. This is required to meet the increasing microprocessor speeds of today’s computer, telecommunications and aerospace equipment.

DTi’s FS Series Conductive Cushion Gaskets have a basic construction of Ni-Cu plated polyurethane (F01) or polyolefin (S01) foam, laminated with conductive fabric. F01 polyurethane foam has a 40% lower compressions set than the S01 polyolefin foam.

Available in roll, sheet, or custom die cut forms.
Unit of Measure

Specifications

Foam Type

 N/A F01

Foam Description

 N/A Conductive Polyolefin Fabric Foam with Ni-Cu-Ni and High Strength Modified Conductive Tape

Maximum Contact Resistance

 N/A 0.1 ohm/square

Minimum Shielding Effectiveness

 N/A 60 dB

Minimum Adhesive Strength Per 25 mm

 N/A 1000 gf

Thickness Options

 N/A 0.4 to 1.7 mm0.016 to 0.067 in

Sheet Dimensions

 N/A 210 x 300 mm

Packaging Options

 N/A
  • Custom Die Cut
  • Rolls

Industry Standards/Certifications

 N/A AS9100 B NSAI Certified ISO 9001:2008 NSAI RoHS UL94

Conductive Foam Properties

Density

 N/A 28.1 lb/ft³450 kg/m³

Tensile Strength

 N/A 583 psi40.0 kgf/cm²

Compression Set

 N/A ≤50 %

Features and Benefits

N/A

  • Flammability per UL94
  • Superior shielding effectiveness combined with Shock Absorption
  • Excellent conductivity-deflection rate
  • Various thicknesses available
  • Easy installation with or without conductive PSA
  • Wide temperature capability -30 ºC to 90 ºC

Applications

N/A

  • Wireless device displays and speaker cutouts
  • Grounding between PCB and chassis
  • PCI bracket
  • Medical equipment
  • Telecommunication equipment
  • Automotive
  • Appliances
  • Computer and Servers

Note

N/A Certified Vendor to Fortune 100 & 500 OEMs, JIT with MAJOR OEMs worldwide, supported by International distribution.

Also available with non-conductive adhesive tape

The information contained in this data sheet is based on our experience to date and is believed to be reliable. It is intended as a guide for use by persons having technical skill at their discretion and risk. We do not guarantee favorable results or assume any liability in connection with its use. Dimensions contained herein are for reference purposes only. For specific dimensional requirements, consult the factory. This publication is not to be taken as license to operate under, or a recommendation to infringe upon any existing patents. This supersedes and voids all previous literature, etc. Device Technologies, Inc. expressly disclaims any and all express or implied warranties concerning its products including without limitation, warranty of fitness for a particular purpose and warranty of merchantability.