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DTi's Single Sided Conductive Fabric Tapes are composed of a conductive textile substrate and adhesive. They offer a thin, lightweight, and flexible shielding design. ST Tapes are ideal for sealing seams or wrapping cables for shielding and grounding applications. It is ideal as a shielding layer on the inside of non-metallic electronic enclosures where EMC is an issue.

Available in roll, sheet or custom die-cut forms.
Unit of Measure

Specifications

Enclosure Type

 N/A Non-Metallic Electronic

Fabric Type

 N/A Ripstop Nickel

Thickness

 N/A 0.0047 in0.12 mm

Width

 N/A 39.37 in1000 mm

Length

 N/A 164 ft50 m

Contact Resistivity

 N/A <0.10 ohm/square

Adhesive Strength per 25 mm

 N/A >900 gf

Service Temperature

 N/A 60 to 100 ºF15 to 38 ºC

Properties

 N/A Adhesive Cost-Effective Electrical Low-Profile Mechanical

Characteristics

 N/A Flexible Shielding Design. Lightweight Thin

Industry Standards/Certifications

 N/A AS9100 B NSAI Certified ISO 9001:2008 NSAI RoHS compliant

Additional Material Options

N/A

  • Thicknesses range from 0.06 mm ~ 0.68 mm
  • Flame retardant layer
  • Conductive or Non-Conductive Adhesive
  • Multiple layers of fabric
  • Polyester film top layer
  • Custom width rolls

Features and Benefits

N/A

  • Excellent shielding effectiveness
  • Highly flexible
  • Lengths of 25 or 50 meters
  • Optional flame retardant layer
  • Can be die cut to custom shapes

Applications

N/A

  • Computer
  • Telecommunications
  • Military
  • General electronics
  • Medical equipment
  • Automotive

Application Techniques

N/A

  • Bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a cleaning agent.
  • Bond strength can be increased by applying ST Series PSA firmly with a roller or finger pressure to exclude air entrapment.
  • Adhesion is optimized when the substrates are flat or conformable.
  • Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.
  • Most metal surfaces give enhanced electrical performance with ST Series PSA by lightly roughing the surface.
  • ST Series PSA should be applied between 60 ºF - 100 ºF (15 ºC - 38 ºC). Tape application below 50 ºF (10 ºC) is not recommended.
  • Warming the substrates to 100 ºF (38 ºC) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.

Note

N/A Certified Vendor to Fortune 100 & 500 OEMs, JIT with MAJOR OEMs worldwide, supported by International distribution.

The information contained in this data sheet is based on our experience to date and is believed to be reliable. It is intended as a guide for use by persons having technical skill at their discretion and risk. We do not guarantee favorable results or assume any liability in connection with its use. Dimensions contained herein are for reference purposes only. For specific dimensional requirements, consult the factory. This publication is not to be taken as license to operate under, or a recommendation to infringe upon any existing patents. This supersedes and voids all previous literature, etc. Device Technologies, Inc. expressly disclaims any and all express or implied warranties concerning its products including without limitation, warranty of fitness for a particular purpose and warranty of merchantability.