COMPANY HEADER
Device Technologies' Ground-Fast grounding system quickly attaches a lid or cover to a panel, protecting printed circuit boards and electronics components. The fastener combines mounting clips, which quickly snaps into holes to create an electrical ground contact from the lid to the panel.
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Unit of Measure
Items
Ground-Fast Universal and Continuous Grounding Panels (07115-2 & 07115-3)

0.044 to 0.056 Inch (in) Gap for Product Size 2 Ground-Fast Universal and Continuous Grounding Panel
Ground-Fast Universal and Continuous Grounding Panels (07115-2 & 07115-3)

0.055 to 0.069 Inch (in) Gap for Product Size 3 Ground-Fast Universal and Continuous Grounding Panel
Ground-Fast Universal and Continuous Groundling Panels

0.069 to 0.090 Inch (in) Gap for Product Size 4 Ground-Fast Universal and Continuous Grounding Panel
Description N/A Device Technologies' Ground-Fast grounding system quickly attaches a lid or cover to a panel, protecting printed circuit boards and electronics components. The fastener combines mounting clips, which quickly snaps into holes to create an electrical ground contact from the lid to the panel.
Material N/A Type 304 Stainless Steel
Gap for Product Size 0 N/A 0.020 to 0.030 in
Gap for Product Size 1 N/A 0.029 to 0.045 in
Gap for Product Size 2 N/A 0.044 to 0.056 in
Gap for Product Size 3 N/A 0.055 to 0.069 in
Gap for Product Size 4 N/A N/A N/A 0.069 to 0.090 in
Gap for Product Size 5 N/A N/A N/A 0.089 to 0.114 in
Gap for Product Size 6 N/A N/A N/A 0.113 to 0.130 in
Electrical Resistivity at 68 ºF N/A 28.4 µohm·in
Electrical Resistivity at 20 ºC N/A 72 µohm·cm
Industry Standards/Certifications N/A AS9100 B/ISO 9001:2008 Certified I.S. EN ISO 9001:2008 ISO 9001:2008 Registration No. AS19.4480 RoHS compliant
Style N/A Continuous Universal
Features and Benefits N/A
  • Flush surface mounting
  • Fast snap-in or solder attachment
  • Fast removal of lid from panel
  • High closure force
  • High tensile strength